Intel LGA2011 (Narrow) Rectangular 1U Copper Heatsink
Thermolab SF2011-1U Narrow ILM Passive Heatsink Cooler for LGA2011 V3 1U
Dimensions: 104 mm (L) x 65 mm (W) x 24 mm (H)
Materials: Copper
Fin Pitch: 1.9 mm
Fin thickness: 0.4 mm
Weight: 425 g
Thermal Grease: Shin-Etsu 7762
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